B2B GST Credit Available
- Stock: 191 in Stock
- SKU: 04708
- Delivery Time
- Bulk & B2B RFQ
BGA Reballing Stencils Universal Steel Stencil for SMT/SMD Motherboard - Pack of 16
This is a BGA Reballing Stencils Universal Steel Stencil for SMT/SMD Motherboard. This Bga Stencils Used For Laptop, CPU, Motherboard repair. These stencils are made of high-quality stainless steel material with perfect thickness. They can be heated by a hot air blower and are not easily deformed when heated and there are many different sizes to meet your different needs.
The area of stencil is matched with the area of BGA chip, which can reduce the waste of solder ball. It is easy and quickly for reballing the BGA IC, useful and economical accessories for BGA soldering.
Feature
- Made of imported stainless steel plate. Good stencil thickness.
- Can be directly heated by air-gun, steel mesh is not easy to deformation by heat.
- Steel mesh area and BGA chip area matching, can reduce the waste of solder ball.
- Universal direct heat BGA stencils for notebooks, desktops, communications motherboards and other graphics cards and other types of BGA chip.
- Each set of 36 pieces. Basically covers the current common BGA chip.
- Universal Stencils only, other accessories demo in the picture is not included!
Specifications
- Item Type : Universal Stencils
- Material : Steel
- Color : Silver
- Quantity : 16pcs/set
BGA Stencils Sizes:
- 1x 0.6mm 31x31mm P=1.1
- 1x 0.6mm 41x41mm
- 1x 0.76mm 30x30mm
- 1x 0.76mm 33x33mm P=1.27
- 1x 0.76mm 41x41mm
- 1x 0.5mm 40x40mm
- 1x 0.3mm 30x30 mm
- 1x 0.45mm 35x35mm P=0.76mm
- 1x 0.76mm 34x34mm
- 1x 0.6mm 36x36mm
- 1x 0.6mm 30x30 mm
- 1x 0.35mm 30x30mm
- 1x 0.4mm 35x35mm
- 1x 0.5mm 35x35mm
- 1x 0.6mm 27x27mm
- 1x 0.6mm 24x24mm
Attention
- Better solder ball has normal content of tin and silver. Melting point is normal.
- Direct heat with air-gun, adjust the temperature. No need too high temperature, otherwise cause deformation.
Warranty Terms :
Branded products (Waveshare/ Raspberry Pi/ Radxa/ DWIN etc) are as per brand warranty terms. Generic products are eligible for replacement within 7 days of delivery based on following conditions.
Products are eligible for a replacement if there is physical damage during transit or a clear manufacturing defect. Any claim for damage/ wrong items/ replacement must be made within 48 hours of successful delivery of the product. Requests for refund of amount or exchange of product(s) will be reviewed on a case by case basis and HUBTRONICS carries final rights to take a final decision on refund, store credit or exchange.
What to take care of ?
Most of our products are technical in nature and require trained personnel to handle them. Any kind of mishandling can result in damage or malfunctioning of the product, it is not possible for us to provide a replacement or refund if the product is damaged due to technical or physical mishandling.
Who pays the return shipping cost?
Free of cost return pickup from delivery address is eligible for products categorized as manufacturing defect/ Damage in transit/ Wrong items delivered. We do not support return pickup for any B2B order or offline orders not placed on website. Buyer need to arrange return shipping for B2B orders.
What voids warranty?
Please note that replacement/ return or refund is not possible if the product is not compatible with your system/application. Please check all the technical details/ dimensions etc. before ordering and contact us for any kind of clarifications.
If product is soldered/ programmed at any point or physically altered in any way, it is not eligible for return/ replacement. If the item requires soldering for testing, please ensure that you use suitable clips or jig to test it without soldering. Any kind of soldering job makes the product ineligible for return or replacement.
Following items are not eligible for return under any circumstances
- Device Programmers / Dongles
- Soldering Consumables (Wire, Flux etc)
