BGA Reballing Stencils Universal Steel Stencil for SMT/SMD Motherboard - Pack of 16

BGA Reballing Stencils Universal Steel Stencil for SMT/SMD Motherboard - Pack of 16

This is a BGA Reballing Stencils Universal Steel Stencil for SMT/SMD Motherboard. This Bga Stencils Used For Laptop, CPU, Motherboard repair. These stencils are made of high-quality stainless steel material with perfect thickness. They can be heated by a hot air blower and are not easily deformed when heated and there are many different sizes to meet your different needs. 

The area of stencil is matched with the area of BGA chip, which can reduce the waste of solder ball. It is easy and quickly for reballing the BGA IC, useful and economical accessories for BGA soldering.

Feature

• Made of imported stainless steel plate. Good stencil thickness.
• Can be directly heated by air-gun, steel mesh is not easy to deformation by heat.
• Steel mesh area and BGA chip area matching, can reduce the waste of solder ball.
• Universal direct heat BGA stencils for notebooks, desktops, communications motherboards and other graphics cards and other types of BGA chip.
• Each set of 36 pieces. Basically covers the current common BGA chip.
• Universal Stencils only, other accessories demo in the picture is not included!

Specifications

• Item Type : Universal Stencils
• Material : Steel
• Color : Silver
• Quantity : 16pcs/set

BGA Stencils Sizes:

• 1x 0.6mm 31x31mm P=1.1
• 1x 0.6mm 41x41mm
• 1x 0.76mm 30x30mm
• 1x 0.76mm 33x33mm P=1.27
• 1x 0.76mm 41x41mm
• 1x 0.5mm 40x40mm
• 1x 0.3mm 30x30 mm
• 1x 0.45mm 35x35mm P=0.76mm
• 1x 0.76mm 34x34mm
• 1x 0.6mm 36x36mm
• 1x 0.6mm 30x30 mm
• 1x 0.35mm 30x30mm
• 1x 0.4mm 35x35mm
• 1x 0.5mm 35x35mm
• 1x 0.6mm 27x27mm
• 1x 0.6mm 24x24mm

Attention

• Better solder ball has normal content of tin and silver. Melting point is normal.
• Direct heat with air-gun, adjust the temperature. No need too high temperature, otherwise cause deformation.