GL-12 830 Tie Points Solderless Breadboard

GL-12 830 Tie Points Solderless Breadboard

The GL-12 830 Tie Points Solderless Breadboard is an essential tool for students, hobbyists, and professionals engaged in electronics prototyping and testing. This breadboard offers a flexible platform for assembling circuits without the need for soldering, making it perfect for experimenting and developing new designs.

Features & Specs

• Total Tie Points: 830 points
• Material: High-quality ABS plastic
  
• Compatibility: Fits all standard sizes of DIP ICs and components with pin spacing of 2.54 mm
  
• Color: White 
• Connection Type: Solderless
  
• Practical and useful
• Completely reusable and have a self-adhesive back
• Easy component placement